certificate atex bas01atex1285u/5 9.25 6.65 10.50-0.0+0.2 1.91 1.91 14.45-0.0+0.2 0.4 0.5 2.54 sensor 0.5 sq 6.5 +0.2 0 surface mount lead form conditions of use apply grd vout vcc an k pin out (top view) 1.75 emitter 0.4x0.45 opi 2000m high speed opto isolator surface mount atex / iecex certified mechanical data the opi 2000m high speed optically coupled isolator consists of a high speed infrared emitter coupled to a silicon photo i.c. the unit is designe d for applications requiring high voltage isolation between input & output. surface mount in trays // tape & reel high speed 2mb/sec. 10kv isolation low propagation delay bedford opto technology ltd 1,biggar business park, biggar,lanarkshire, ml12 6f x tel: +44 (0) 1899 221221 fax : +44 (0) 1899 221009 website: bot.co.uk e-mail: bill@bot.co.uk 1/5 iss m 20.10.12 pb this component is rohs compliant confirmed conform to:- en60079-0:2012 en60079-11:2012 en60079-26:2007 conditions of use apply:- see schedule of limitations on certificate / details repeated on page 4 this datasheet. certificate iecex bas 06.0021u/4 confirmed conform to:- iec 60079-0:2011 edition 6 iec 60079-11:2011 edition 6 iec 60079-26:2006 edition 2 conditions of use apply:- see schedule of limitations on certificate / details repeated on page 4 this datasheet
bedford opto technology ltd 1,biggar business park, biggar,lanarkshire, ml12 6f x tel: +44 (0) 1899 221221 fax : +44 (0) 1899 221009 website: bot.co.uk e-mail: bill@bot.co.uk absolute maximum ratings (25 o c unless otherwise noted) input diode forward dc current reverse dc voltage power dissipation 100ma 5 volts 150mw (ii) output ic max supply voltage power dissipation 7 volts 165mw operating temp -40 o c to +80 o c storage temp -40 o c to +80 o c input-to-output isolation voltage + 10kv dc (i) i) measured w ith the input leads and output leads sho rted together for one min. ii) thermal resistance 450 k/w whilst the devices are capable of operating continu ally at the noted elevated temperatures users should be aw are of the possibili ty of the need to increase the diode current to trigger the device over long periods at high temperatures & currents. OPI2000M + + vgen rf gnd vout vcc r c l r =560 ohm c=0.01uf l packing waffle trays - 100 per tray 290mm x 200mm. tape & reel - 300 devices per 13 diam reel with 7 hub 24mm wide tape. circuit pb this component is rohs compliant 2/5 iss m 20.10.12
advised soldering conditions bedford opto technology ltd 1,biggar business park, biggar,lanarkshire, ml12 6f x tel: +44 (0) 1899 221221 fax : +44 (0) 1899 221009 website: bot.co.uk e-mail: bill@bot.co.uk opi 2000m pb this component is rohs compliant 3/5 iss m 20.10.12
opto electronic data (ta = 25 o c) bedford opto technology ltd 1,biggar business park, biggar lanarkshire, ml12 6f x tel: +44 (0) 1899 221221 fax: +44 (0) 1899 221009 website: bot.co.uk e-mail: bill@bot.co.uk opi 2000m parameter symbol min typ max units test conditions input diode forward voltage v f - 1.35 1.6 v if=100ma tp=20ms reverse voltage v r 5.0 - - v ir = 100ua output ic ( vcc=4.75 to 5.25 ) high level output current i ch - 100 ua ic = 10 ua low level output voltage v ol - 0.6 v i f= 10ma i ol= 2.6ma high level supply current i cch 15 ma i f=0 low level supply current i ccl 18 ma i f=7.5ma coupled(vcc=5v olts) propagation delay to low output lev el t plh 800 nsecs r l= 560ohms c=0.01uf propagation delay to high output lev el t phl 800 nsecs ditto input/output isolation voltage vi-o 10kv volts input and output leads shorted pb this component is rohs compliant 4/5 iss m 20.10.12 ec type ex amin ation certificate no. bas01 atex1285u/5 28t h september 2012 schedule of limitations 1 ) - the surface mounted opto is olator OPI2000M must be mounted on a p.c.b. having a cti of at least 17 5 so that creepage and clearanc e distances are not impaired. the surface mounted device is d esigned for the pins to be s oldered to the pads on the same si de of the printed circuit board as the c omponent and must onl y be used either:- a) on a printed circuit board which is potted prov i ded that the pad s egregation mai ntains at least 2m m under potting. or b) on a printed circuit board which is c oated prov ided that the pad segregation mainyains at least 3. 3mm under coating. where the coating shall seal the connections after s olderi ng and s hall be two coats if applied by s praying or a single coat if dipped, brus hed or vacuum i mpregn ated. a cti of at least 175 shall appl y t o both the pc b substrate and the coating material. this c ondition 1), does not apply to the thr ou gh hole version, OPI2000Mth for voltages up to 375v peak or d.c. provided that the mounti ng arrangemen t does not reduce the creepage distances to less than 10mm. 2) - the opto isol ators OPI2000M and OPI2000Mth may be us ed to provide isolati on between either:- (i) a non-intrinsically s afe circuit and an intri nsicall y safe circuit, (non is:is), where the is ci rcuit voltage is not greater than 75 volts peak or d.c .. or (ii) two intrinsicall y safe circuits (is:is), wher e the sum of the two circuit voltages is not greate r than 375 volts peak or d.c.. 3) - the opto isol ators OPI2000M and OPI2000Mth mus t be ins talled suc h that the connection pins are pr ovided with a degree of protection of at least ip20 where gass es and vapours may be pres ent . if the opto is olators are to be i nstalled where d usts r epres ent a hazar d, then it must be pr ovi ded w ith a degree of protec tion of at l east ip54 and the overall apparatus must be appropriatel y certifi ed for the requirements for dusts. 4) - the opto isol ators OPI2000M and OPI2000Mth mus t be ins talled with external power limiting compone nts as s pecifi ed in:- en60079-11:2012, claus e 8.9.2. certificate no.:- iecex bas 06.0021u date of issue:- 2012-10-02 i ssue no.: 4 schedule of limitations 1. w hen used in intrinsically safe apparatus it wil l be necessary to determ ine a surface tem perature classification for the opto-isolator:- 2. the opto isolator m ust be m ounted on a printed c ircuit board such that creepage and clearance distances are not im paired. 3. the opto c oupler m ust be installed such that the connection pins are provided with a degree of protection of ip20 where gasses and vapours m ay be present. if the opto c oupler is to be in- stalled within apparatus where flamm able dusts represent the hazard then it m ust be prov ided with a degree of protection of ip54 and the apparatus m ust be appropriately certi f ied f or dust hazards. 4. surface mount OPI2000M only and in addition to above: the surf ace m ount OPI2000M m ust only be used on a printed circuit board that is either: a) potted, providing the pad segregation rem ain s at least 2m m under the potting or b) conf orm ally coated, prov ided the pad segrega tion rem ains at least 3.3m m under the coating. the conf orm al coating m ust hav e c ti in excess of 175. 5. the opto isolator m ust be installed with externa l power lim iting com ponents as specif ied in:- iec 60 079-11:2011 ed 6, c lause 8.9.2. schedule of limitations
conformity statement OPI2000M manufacturer:- bedford opto technology ltd address:- 1 biggar business park, market road, biggar, lanarkshire, ml12 6fx, scotland directive 94/9/ec ec-type examination certificate:- bas01atex1285u C latest supplement bas01atex1285u/ 5 issued sept 2012 provisions of the directive fulfilled by the compon ent:- ex ia iic ga (-40c ta +80c) ii 1 gd ex ia iiic da (-40c ta +80c) notified body for ec-type examination & production: - baseefa ltd. C no.1180 baseefa ltd. rockhead business park, staden lane, tel:- +44 (0)1298 766600 buxton, fax:- +44 (0)1298 766601 derbyshire sk17 9rz, e-mail:- info@baseefa.com england harmonised standards used:- en60079-0: 2012 en60079-11: 2012 en60079-26:2007 other standards used:- pb this component is rohs compliant on behalf of bedford opto technology ltd., i decla re that, the date the component accompanied by this statement is placed on the mark et, the component conforms with all technical and regulatory requirements of t he atex directive 94/9/ec and the rohs directive 2011/65/eu . _________________________________ mr r.w.stott managing director pp- 5/5 iss m 20.10.12 opi 2000m
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